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A ball grid array (BGA) is a type of surface-mount packaging used for integrated circuits. This page may meet Wikipedia’s criteria for speedy deletion. ...
Surface-mount components on a keydrives circuit board Surface mount technology (SMT) is a method for constructing electronic circuits in which the components are mounted directly onto the surface of printed circuit boards (PCBs). ...
Integrated circuit showing memory blocks, logic and input/output pads around the periphery Microchips with a transparent window showing the integrated circuit inside. ...
BGA
The BGA is descended from the pin grid array (PGA), which is a package with one face covered (or partly covered) with pins in a grid pattern. These pins are used to conduct electrical signals from the integrated circuit to the printed circuit board (PCB) it is placed on. In a BGA, the pins are replaced by balls of solder stuck to the bottom of the package. The device is placed on a PCB that carries copper pads in a pattern that matches the solder balls. The assembly is then heated, either in a reflow oven or by an infrared heater, causing the solder balls to melt. Surface tension causes the molten solder to hold the package in alignment with the circuit board, at the correct separation distance, while the solder cools and solidifies. Image File history File links Size of this preview: 647 × 599 pixel Image in higher resolution (1480 × 1371 pixel, file size: 582 KB, MIME type: image/jpeg) Other versions Originally from de. ...
Image File history File links Size of this preview: 647 × 599 pixel Image in higher resolution (1480 × 1371 pixel, file size: 582 KB, MIME type: image/jpeg) Other versions Originally from de. ...
Integrated circuit showing memory blocks, logic and input/output pads around the periphery Microchips with a transparent window showing the integrated circuit inside. ...
Close-up photo of one side of a motherboard PCB, showing conductive traces, vias and solder points for through-hole components on the opposite side. ...
Package Diagram for 168-Pin PGA Embedded IntelDX2™ Processor The pin grid array or PGA is a type of packaging used for integrated circuits, particularly microprocessors. ...
The grid plan is a type of city plan in which streets run at right angles to each other, forming a grid. ...
Close-up photo of one side of a motherboard PCB, showing conductive traces, vias and solder points for through-hole components on the opposite side. ...
A solder is a fusible metal alloy, with a melting point or melting range below 450 °C (840 °F), which is melted to join metallic surfaces, especially in the fields of electronics and plumbing, in a process called soldering. ...
A reflow oven is a high-precision oven used primarily for soldering electronic components to printed circuit boards using surface mount techniques. ...
Image of two girls in mid-infrared (thermal) light (false color) Infrared (IR) radiation is electromagnetic radiation of a wavelength longer than that of visible light, but shorter than that of radio waves. ...
In physics, surface tension is an effect within the surface layer of a liquid that causes that layer to behave as an elastic sheet. ...
Advantages
High density The BGA is a solution to the problem of producing a miniature package for an integrated circuit with many hundreds of pins. Pin grid arrays and dual-in-line surface mount (SOIC) packages were being produced with more and more pins, and with decreasing spacing between the pins, but this was causing difficulties for the soldering process. As package pins got closer together, the danger of accidentally bridging adjacent pins with solder grew. BGAs do not have this problem, because the solder is factory-applied to the package in exactly the right amount.
Heat Conduction A further advantage of BGA packages over leaded packages (i.e. packages with legs) is the lower thermal resistance between the package and the PCB. This allows heat generated by the integrated circuit inside the package to flow more easily to the PCB, preventing the chip from overheating. Thermal resistance has two different meanings: 1) the temperature difference across the structure when a unit of heat energy flows through it in unit time or 2) the temperature difference across a unit area of a material of unit thickness when a unit of heat energy flows through it in...
Low Inductance leads The shorter an electrical conductor, the lower its inductance, a property which causes unwanted distortion of signals in high-speed electronic circuits. BGAs, with their very short distance between the package and the PCB, have low inductances and therefore have far superior electrical performance to leaded devices. Inductance (or electric inductance) is a measure of the amount of magnetic flux produced for a given electric current. ...
BGAs find some use in security-sensitive applications, especially where it is impossible to prevent physical access to the chip. For instance, a ROM chip with a BGA configuration is considerably more difficult to access than one in a DIP or TSOP layout. Tracing circuit paths to the BGA chip is limited by the contact points being obscured by the chip itself. ICs in DIP14-Package Several PDIPs and CERDIPS. The large CERDIP in the foreground is an 8080 processor. ...
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Disadvantages Image File history File links Size of this preview: 600 × 600 pixel Image in higher resolution (1024 × 1024 pixel, file size: 328 KB, MIME type: image/jpeg) Xray picture of a Ball Grid Array Integrated Circuit on a Printed Circuit Board File links The following pages on the English Wikipedia...
Image File history File links Size of this preview: 600 × 600 pixel Image in higher resolution (1024 × 1024 pixel, file size: 328 KB, MIME type: image/jpeg) Xray picture of a Ball Grid Array Integrated Circuit on a Printed Circuit Board File links The following pages on the English Wikipedia...
In the NATO phonetic alphabet, X-ray represents the letter X. An X-ray picture (radiograph) taken by Röntgen An X-ray is a form of electromagnetic radiation with a wavelength approximately in the range of 5 pm to 10 nanometers (corresponding to frequencies in the range 30 PHz...
Non compliant leads A disadvantage of BGAs, however, is that the solder balls cannot flex (non-compliant) in the way that longer leads can. Bending, due to a difference in Coefficient of thermal expansion between PCB substrate & BGA (thermal stress), or flexing & vibration (mechanical stress) can cause the solder joints to fracture. BGAs are therefore unpopular in certain fields, such as aerospace and military electronics. This problem can be overcome, at a cost, by matching the mechanical and thermal characteristics of the PCB to those of the BGA. During heat transfer, the energy that is stored in the intermolecular bonds between atoms changes. ...
Expensive inspection Another disadvantage of BGAs is that, once the package is soldered down, it is very difficult to look for soldering faults. X-ray machines and special microscopes have been developed to overcome this problem, but are expensive. If a BGA is found to be badly soldered, it can be removed in a rework station, which is a jig fitted with infrared lamp (or hot air), a thermocouple and a vacuum device for lifting the package. The BGA can be replaced with a new one, or can be refurbished or reballed. Packets of tiny ready-made solder balls are sold for this purpose. In the NATO phonetic alphabet, X-ray represents the letter X. An X-ray picture (radiograph) taken by Röntgen An X-ray is a form of electromagnetic radiation with a wavelength approximately in the range of 5 pm to 10 nanometers (corresponding to frequencies in the range 30 PHz...
In electronics, thermocouples are a widely used type of temperature sensor and can also be used as a means to convert thermal potential difference into electric potential difference. ...
BGA Variants - FBGA or Fine Ball Grid Array based on ball grid array technology. It has thinner contacts and is mainly used in system-on-a-chip designs.
- Known as FineLine BGA by Altera.
- CBGA and PBGA denote the Ceramic or Plastic substrate material to which the array is attached.
- PBGA known as plastic ball grid array
System-on-a-chip (SoC or SOC) is an idea of integrating all components of a computer system into a single chip. ...
See also
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