A chip scale package (CSP) (sometimes, chip-scale package with a hyphen) is a type of integrated circuitchip carrier that has no pins or wires but uses contact pads instead. To be considered a CSP, a package must have an area no greater than 1.2 times that of the die packaged. SEM image of an integrated circuit showing defects in the aluminium layer deposition (shown in cyan). ... Look up die in Wiktionary, the free dictionary. ...
The die may be mounted on an interposer upon which pads or balls are formed, as in ball grid array (BGA) packaging and flip chip BGA packaging, or the pads may be etched or printed directly onto the silicon wafer, resulting in a package very close to the size of the silicon die: such a package is called a wafer level chip scale package (WL-CSP) or a wafer level package (WLP). A ball grid array is a type of surface-mount packaging used for integrated circuits. ... A flip chip is one type of IC chip mounting which does not require any wire bonds. ...
External links
Chip Scale Package – Definition and general information, from SemiconFarEast.com
The essence of WLP is that the packages are formed directly on the wafer, before the wafers are sawn and the die are singulated.
It is conventionally referred to as "zero-level packaging," to distinguish it from first-level packaging, which connects the die to a lead frame or separate package.
Chipscalepackages are becoming common in RF, particularly for packaging RFICs for cellular telephones and wireless LANS.
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