Contact Image Sensors (CIS) are a relatively recent technological innovation in the field of optical flatbed scanners that are rapidly replacing CCDs in low power and portable applications. As the name implies, CIS's place the image sensor in near direct contact with the object to be scanned in contrast to using mirrors to bounce light to a stationary sensor, as is the case in conventional CCD scanners. A CIS typically consists of linear array of detectors, covered by a focusing lens and flanked by Red, Green, and Blue LEDs for illumination. Usage of LEDs allows the CIS to be highly power efficient, with many scanners being powered through the minimal line voltage supplied via a USB connection. At the moment, CIS's generally produce images of inferior resolution and quality when compared to their CCD brethren, but, as the technology is still young, this is bound to change. In computing, a scanner is a device which analyzes a physical image (such as a photograph, printed text, or handwriting) or an object (such as ornament) and converts it to a digital image. ... A charge-coupled device (CCD) is a sensor for recording images, consisting of an integrated circuit containing an array of linked, or coupled, capacitors. ... Various light-emitting diodes (5 mm reds, 3 mm greens and yellows) A light-emitting diode (LED) is a semiconductor device that emits incoherent monochromatic light when electrically biased in the forward direction. ... Note: USB may also mean upper sideband in radio. ...
In the first contact type imagesensor of the present invention, the light detecting element array is formed directly on the substrate of the optical fiber array member, and the driving circuit is also disposed on the same substrate.
In the second contact type imagesensor of the present invention, the composite optical fiber array member includes a first optical fiber array member which fiber is not coated with a light absorber, and a second fiber array member which fiber is coated with the light absorber.
A manufacturing procedure of the imagesensor 102 of the second embodiment is similar to the above described case of the imagesensor 101 of the first embodiment except in the process (D), the LSI 12 is flip chip-bonded onto the substrate 5 by use of the bonding medium 13.