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Die attach pad adapted to reduce delamination stress and method of using same - Patent 6169322 (9201 words) |
 | A surface ("die attachment surface") of a die 101 is attached to a surface ("die attach pad attachment surface") of a die attach pad 102 with a die attach material 103. |
| The die attach stress increases as the distance from the center of the die increases, due to the differential CTE stress: in general, the die attach stress in any direction from the center of the die is at a maximum at the edge of the die, indicated by the numerals 202a and 202b in FIG. |
| The die attach sections 802a and 802b are positioned so that the centers of the die attach sections 802a and 802b lie on a major axis of the die attach pad 802 and are equidistant from a minor axis of the die attach pad 802. |
| Methods of die attachment for BOC and F/C surface mount - Patent 6691406 (4517 words) |
| One method of attaching a die to a substrate is to apply a paste to the die or the substrate and to dispose the die onto the substrate. |
| Die 42 is attached to substrate 44 by adhesive 48. |
| A plurality of conductive balls 50 are arranged in an array on the surface of the substrate opposite the die 42. |
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