During the die cutting or dicing process, a wafer with sometimes thousands of identical integrated circuits is cut into individual pieces, called dies. In between the functional parts of the circuits, a thin non-functional spacing is foreseen where a saw can safely cut the wafer without damaging the circuit. This spacing is called the scribe. The width of the scribe is very small, typically around 100 μm. A very thin and accurate saw is therefore needed to cut the wafer into pieces. Usually the dicing is performed with a water-cooled circular saw with diamond tipped blades. See Wafer (cooking) for the original meaning of the word. ... An integrated circuit (IC) is a thin chip consisting of at least two interconnected semiconductor devices, mainly transistors, as well as passive components like resistors. ... Die can refer to: To die is to undergo death. ... A micrometre (American spelling: micrometer), symbol µm, is an SI unit of length. ...
Die cutting is used for all kinds of manufacturing processes that have nothing to do with chips. Leather, fabrics, rubber, etc. are cut to patterns this way. Here is a good description: http://www.dieco.com/whatis.htm
DieCutting: Using steel rule dies, we can process sheet plastic, corrugated plastic, gaskets, chipboard, fabric, paperboard, foam, rubber, foam rubber, open cell foams, closed cell foams, neoprene, hypalon, felt, cork, thin metals (.005 or less), wood, acrylic, composites, fiberglass, magnets, sponge, diecuts (crafts) or any other flat material normally found in the industry.
DieCutting: Recently we have been awarded several custom contracts with OEM's, consumer goods, recreation and food industry corporations because of our very low pricing.
DieCutting Setup Fees: We are the ONLY company which will diecut any size job without a set up fee.
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