Package Diagram for 168-Pin PGA Embedded IntelDX2™ Processor
The pin grid array or PGA is a type of packaging used for integrated circuits, particularly microprocessors. The integrated circuit (IC) is mounted in a ceramic slab of which one face is covered, or partially covered, in a square array of metal pins. The pins can then be inserted into the holes in a printed circuit board and soldered in place. They are almost always spaced a tenth of an inch (2.54mm) apart. For a given number of pins, this type of package occupies less space than older types such as the dual in-line package (DIL or DIP).
The plastic pin grid array (PPGA) and later flip-chip pin grid array (FCPGA) versions were both created by Intel Corporation for their Pentiumprocessors, and are often used on motherboards with ZIF (Zero Insertion Force) sockets to protect the delicate pins.
The layer structure of an FCPGA substrate is displayed in Figure 2; the targeted thickness of each layer and package key feature sizes are given in Table 2.
A total of 100 FCPGA samples were tested with uniform and edge-loaded forces (20 to 100 lbs).
These data, collected since early in the development phase, built sufficient confidence that the FCPGA package was a viable packaging solution for current as well as future microprocessors.
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