A flip chip is one type of IC chip mounting which does not require any wire bonds. Instead the final wafer processing step deposits solder beads on the chip pads. After cutting the wafer into individual dice, the "flip chip" is then mounted upside down in/on the package and the solder reflowed. Flip chips then normally will undergo an underfill process which will cover the sides of the die, similar to the encapsulation process. The terminology flip chip originates from the upside down (i.e. flipped) mounting of the die. This leaves the chip pads and their solder beads facing down onto the package, while the back side of the die faces up. This mounting is also known as the Controlled Collapse Chip Connection, or C4. SEM image of an integrated circuit showing defects in the aluminium layer deposition (shown in cyan). ... A wire is a single, usually cylindrical, elongated strand of drawn metal. ... An etched silicon wafer In microelectronics, a wafer is a thin slice of semiconducting material, such as a silicon crystal, upon which microcircuits are constructed by doping (for example, diffusion or ion implantation), etching, and deposition of various materials. ... A solder is a fusible metal alloy (often of tin and lead, although lead-based solders were outlawed in many parts of the world in the 1980s), with a melting point or melting range below 450°C (840°F) and is melted to join metallic surfaces, especially in the...

KA10 Flip Chip containing 9 transistors, 1971

Flip-Chip® modules were used in the DEC PDP-7, PDP-8, PDP-9 and PDP-10, beginning on August 24, 1964. The modules were called Flip-Chip because early versions of some of these modules used flip chip mounting for individual diode chips, but were eventually found to be unreliable so conventional discrete diodes replaced the flip chips. In later computers where DEC used integrated circuits they continued to use "Flip-Chip®", despite the fact that actual flip chip mounting was not used, so that they could retain their trademark. Eventually the trademark was allowed to expire. Image File history File links KA10_mod_top. ... Image File history File links KA10_mod_top. ... The PDP-10 was a computer manufactured by Digital Equipment Corporation (DEC) from the late 1960s on; the name stands for Programmed Data Processor model 10. It was the machine that made time-sharing common; it looms large in hacker folklore because of its adoption in the 1970s by many... Digital Equipment Corporation was a pioneering company in the American computer industry. ... DEC PDP-7 Minicomputer(circa 1965) A modified PDP-7 under restoration in Oslo, Norway The DEC PDP-7 is a minicomputer produced by Digital Equipment Corporation. ... A PDP-8 on display at the Smithsonians National Museum of American History in Washington, D.C.. This example is from the first generation of PDP-8s, built with discrete transistors and later known as the Straight 8. ... PDP is also used as an acronym for Plasma Display Panel. ... The PDP-10 was a computer manufactured by Digital Equipment Corporation (DEC) from the late 1960s on; the name stands for Programmed Data Processor model 10. It was the machine that made time-sharing common; it looms large in hacker folklore because of its adoption in the 1970s by many... August 24 is the 236th day of the year in the Gregorian Calendar (237th in leap years), with 129 days remaining. ... For the Nintendo 64 emulator, see 1964 (Emulator). ... ... SEM image of an integrated circuit showing defects in the aluminium layer deposition (shown in cyan). ... A trademark (Commonwealth English: trade mark) is a distinctive sign of some kind which is used by a business to uniquely identify itself and its products and services to consumers, and to distinguish the business and its products or services from those of other businesses. ...

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• Related Machines for Flip Chip