|
Thick film hybrid circuit board device and method of manufacturing the same - Patent 5256836 (0 words) |
 | A method of manufacturing a thick film hybrid circuit board device according to claim 1, a volume of the recessed portions is set to a value which is substantially equivalent to an amount of bleedings generated from said another layer printed on said first layer. |
| For example, a thick film hybrid circuit board device having a resistor element as a circuit element is manufactured by printing, e.g., screen printing a first layer as a resistor on the insulative base board and by laminating a second layer on both peripheral edge portions of the first layer as a pair of electrodes. |
| However, in this type of the conventional thick film hybrid circuit board device, stagger portions exist between the upper surface of the insulative base board and a cross portion where a peripheral edge portion of the resistive layer and that of a pair of electrode layers are mutually cross. |
| Contact terminal device for connecting hybrid circuit modules to a printed circuit board - Patent 4555151 (1725 words) |
| Normally, a male section of a terminal is inserted into component holes on a printed circuit board and an edge of a hybrid circuit module installed at a U-shaped section which extends from the male section of the terminal. |
| A second hybrid circuit module 171 or a segmented portion of a hybrid circuit module may be added to the already installed hybrid circuit assembly by adding additional terminal devices to the terminal accepting portion 40 of the installed terminal devices. |
| The hybrid circuit module 171 is then inserted between tongue 131 and lower body 132 of the second terminal device, electrically connecting the now two hybrid circuit modules 171 and 70 to the printed wiring card 60. |
Feeds |
Contact