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A ceramic spacer having a thickness substantially equal to the thickness of the die is placed adjacent an edge of the die, with the gold leads also bonded to the ceramic spacer.
A metallized ceramic spacer having a thickness substantially equal to the thickness of the die (silicon and dielectric together) is placed adjacent the edge of the die, and the gold ribbon lead is bonded to the ceramic spacer.
As the exposed epoxy 38 in the spaces between the ceramic spacers is a small fraction of the total bonding surface, the epoxy (which does not reflect the laser light) does not interfere with the identifying of the plane of the bonding surface.
The cable is formed by extrusion of the sheath over the twisted core conductors after insertion of the spacers, and is vacuum corrugated after extrusion, the corrugator being specially formed and operated so as to accommodate the locations whereat the spacer ends engage with and locally deform the extruded sheath.
The arrangement is necessarily such as to obtain synchronisation of insertion of spacers with the advance of the cable cores to and through the extruder and the operation of the corrugator, and any suitable and convenient means may be employed for achieving this.
As can be seen, the spacers are received at appropriately formed mould blocks spaced apart from one another by one-half of the lay length of the twisted cable cores, these specially formed mould blocks accommodating the deformations caused in the extruded sheath by the tips of the spacers.
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