| United States Patent Application: 0040092049 (6591 words) |
 | In the prober and in one cassette out of plural cassettes, each containing wafers with an integrated circuit formed thereon, a predetermined cassette is replaced with another cassette after the end of processing of the predetermined cassette, and it is thereby made possible to continuously conduct an electrical characteristic test for the wafers. |
 | The probers 1 are each provided for testing, chip by chip, an electrical characteristic of a predetermined integrated circuit formed on a wafer in the wafer processing step. |
 | The prober I may be of an existing hardware configuration, but the software thereof has been modified so as to be applicable to a multi-item continuous lot check in the prober and so as to permit an automatic change of item parameters and measurement temperatures corresponding to various items. |