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Encyclopedia > Wafer prober

A wafer prober is a machine used to test integrated circuits. An integrated circuit (IC) is a thin chip consisting of at least two interconnected semiconductor devices, mainly transistors, as well as passive components like resistors. ...


Overview

Silicon Chips (also known as integrated circuits) are fabricated in large numbers by a complex series of printing steps on Silicon Wafers. This process permits integrated circuits to be produced cheaply but each chip must be tested prior to its separation from the wafer (using a process known as wafer dicing). The testing of the wafer in this process is also known as wafer sort. An integrated circuit (IC) is a thin chip consisting of at least two interconnected semiconductor devices, mainly transistors, as well as passive components like resistors. ... Wafer testing is a step performed during semiconductor device fabrication. ...


For electrical testing a set of microscopic contacts or probes called a Probe card are held in place whilst the wafer is moved into electrical contact. When a die (or array of dice) have been electrically tested the prober moves the wafer to the next die (or array) and the next test can start. The Wafer Prober is usually responsible for loading and unloading the wafers from their carrier (or cassette) and is equipped with automatic pattern recognition optics capable of aligning the wafer with sufficient accuracy to ensure accurate registration between the contact pads on the wafer and the tips of the probes.


  Results from FactBites:
 
United States Patent Application: 0040092049 (6591 words)
In the prober and in one cassette out of plural cassettes, each containing wafers with an integrated circuit formed thereon, a predetermined cassette is replaced with another cassette after the end of processing of the predetermined cassette, and it is thereby made possible to continuously conduct an electrical characteristic test for the wafers.
The probers 1 are each provided for testing, chip by chip, an electrical characteristic of a predetermined integrated circuit formed on a wafer in the wafer processing step.
The prober I may be of an existing hardware configuration, but the software thereof has been modified so as to be applicable to a multi-item continuous lot check in the prober and so as to permit an automatic change of item parameters and measurement temperatures corresponding to various items.
  More results at FactBites »


 

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