Ball bonding usually is restricted to gold and copper wire and usually requires heat. Wedge bonding can use either gold or aluminum wire, with only the gold wire requiring heat.
In either type of wire bonding, the wire is attached at both ends using some combination of heat, pressure, and ultrasonic energy to make a weld.
Wire bonding is generally considered the most cost-effective and flexible interconnect technology, and is used to assemble the vast majority of semiconductor packages.
Wirebonding is a method of making interconnections between a microchip and the outside world as part of semiconductor device fabrication.
In either type of wirebonding, the wire is attached at both ends using some combination of heat, pressure, and ultrasonic energy to make a weld.
Wirebonding is generally considered the most cost-effective and flexible interconnect technology, and is used to assemble the vast majority of semiconductor packages.
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